| Price Range: | 50~300 |
|---|---|
| Minimum Order Quantity: | 1000 Ton |
| Certification Requirements: | SGS , LAB REPORT |
| Post Date: | Mar 15, 2008 |
| Expiry date: | Mar 14, 2009 |
|
Good day,
We've got to know that your esteemed company is dealing in such several silicon materials as Silicon Ingot Bricks, IC grade Pot scrap/Tail & Tail, IC grade wafer, IC grade broken wafer etc..., and we would like to know if your esteemed company still have these materials and can supply the same regularly as well. And also we would like know the origin of these material. Kindly let us receive your reply to these.
And if a,m products are still available, kindly let us receive your best offer for the same so we can check out and purchase if everything is okay
Looking forward to establishing the good business relationship with your esteemed company, your prompt reply will be highly appreciated.
Thanks and regards,
Mr.SURADACH
MANAGING DIRECTOR.
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1.
Mono silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)x(150+/-0,5) mm,
P-type, Boron doped,
Resistivity : 0.5 -3.0 Ohm-cm,
Life time : >10 �s,
Thickness: 200+/-40 �m,
2.
Mono silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)mm cut from diameter 166.2+/-1mm,
N-type, Phosphorus doped,
Resistivity : 0.5 -3.5 Ohm-cm,
Orientation <100>+/-3 degree,
Life time : >50�s,
Thickness: 220+/-30�m,
TTV <40�m,
Oxygen content: <1 x 1018 at/cm3,
Carbon content: <5 x 1016 at/cm3,
Surface: cut and cleaned,
Angle between sides: 90+/-0.3 degree,
Depth of saw marks: <20�m,
Edge chips: less than 2 pcs with size <1mm x 0.8mm,
Chips with depth <0.2mm are allowed,
Cracks are not allowed.
3.
Multy silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)mm,
P-type, Boron doped,
Resistivity : 0.5 2.0 Ohm-cm,
Orientation <100>+/-3 degree,
Life time : >1.5�s,
Thickness: 240+/-30�m,
TTV <40�m,
Oxygen content: <4 x 1017 at/cm3,
Carbon content: <5 x 1017 at/cm3,
Surface: cut and cleaned,
Angle between sides: 90+/-0.3 degree,
Depth of saw marks: <20�m,
Corner length 1.4-2.85mm,
Edge chips: less than 2 pcs with depth <0.5mm and width <10mm,
Small chips with length <0.2mm are allowed,
Cracks are not allowed.