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Electronic Assembly Service

Date Posted: 29 Jul 2009
Offer Expires: 29 Jan 2010

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Detailed Buying Lead Description

Micro Electronics company in Atlanta, GA, USA would like to contract the manufacture of high volume electronic assemblies. The contract assembler should have the capability to perform chip placement, wire bonding, BGA attachment and complimentary services for small die level electronic assemblies. Annual contracts will be initiated to the contracting company.
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