BGA Inspection Microscope machine MS3000D
Pixel count: Two million pixels
Image output: USB2.0
Resolution: 1600 x 1200
The Feature The MS-3000 is a microscope for effectively inspecting the soldered portions of the BGA and CSP which are difficult to reach by the X-ray inspection method. Specifically, it is efficient for inspecting the fillets of soldered balls, melted condition of soldered parts, cracks, and defective soldering. Since inspection is done using the backlight and the two sidelights on the camera, inspection of soldered balls at a depth of 15mm can be done using the 70x L Probe. It can also be used for inspecting the bridges of the soldered balls. The LH Probe with a magnification of from 70x to 140x is suitable for the inspection of small soldered balls on BGAs and CSPs. We recommend that you set the magnification to 140x for inspecting the soldering portions on BGAs and CSPs. The SH Probe with a magnification of 300x is suitable for the inspection of soldered balls with a height of approximately 0.1 mm on BGAs, CSPs, and bridge chips. Also, by mounting the standard-shipped straight prism at the head, the MS-3000 can inspect the surface-mounted parts of QFPs. From an angular position, it can be used to inspect the melted and un-melted status of soldering. The microscope can be connected to the PC with the UB pack (USB2.0 connection). Electric power can be supplied from the PC via the USB cable. A viewer software for image storing, two-point calibrating, and a marker function is also standard-shipped with the microscope. Note: The Holder to hold the print board is an option. The following three types of Camera Probes are available: Select the Probe that best fits your needs.
1. L Probe 70x P=1.27 - 1.0: Minimum height of observation=0.3mm