BGA Reballing Stencil

FOB Reference Price:Get Latest Price
US $1-2 / Set | 10 Set/Sets good quality (Min. Order)
Supply Ability:
50 Set/Sets per Week nice aftersale service
Port:
FOB
Overview
Quick Details
Brand Name:
WILLDONE
Model Number:
ST001
Place of Origin:
Guangdong, China (Mainland)
color:
silver
function:
for BGA IC reballing
soldering ball:
0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm
Packaging & Delivery
Packaging Details
standard exporting packing
Delivery Time
1.5 weeks

BGA Reballing Stencil

 

Stencil with stainless steel plate material used for BGA IC Re-balling - stencil

 

Stencil used for BGA IC reballing

with stainless steel plate material

laser drilling

uniform aperture

working with the general air guns to hand-ball

mesh won't deformation when heated directly

 

50 pieces/set

 

Reballing Station with handle + Allen key

Good quality re-balling station for all the large CPU, VGA,Mobile chip..., BGA component soldering/re-soldering works, Easy control.

BGA FLUX/SOLDER PASTE RMA-223-UV OR RMA-559-UV 100G Bottle

 

BGA solder leaded balls

solder ball (250k)
ball size: 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm
Spec =brand new SN63/Pb37

BGA solder lead free solder ball (250k)
ball size: 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm
Spec Sn96.5% AG3% Cu0.5%