Brand Shuttle Star RW-SV550A Full Automatic BGA Rework Station for BGA/LGA Chips like Laptop Motherboard
Shutte Star (RW-SV550A) with CCD camera optical alignment machine (1080P)
Working table adjustment
± 120mm forward/backward, ± 80mm left/right
K-type thermocouple, close cycle controlled
Upper heater(hot air)
Lower heater(hot air)
Bottom IR heater
Max BGA weight
Independent 3 Heater: Upper/Lower hot air heating, Bottom IR preheating
1.The upper&lower heaters: BGA can be heated from upper and bottom at the same time.
temperature accuracy within ±2℃,make BGA melt completely;
2.IR preheating area is adjustable according to desire requests and PCB size,
and matched with PCB clamps to make PCB heating evenly and protect motherboard from
deformation during heating process;
3. PLC operate interface display real-time temperature profile,
so you can monitor BGA temperature change all the time.
4. Unlimited save temperature profile for later use. even if you have no BGA rework experience ,
You can desoldering/soldering BGA chip. Easy operation .
5. 8 stages temperature running, Refer Relow soldering process .
it is beneficial to know the whole package's temperature distribution characteristic
Flexible PCB Clamp Jig and Support Rail
Optical Camera with laser positioning:
1.Optics camera with Laser light can help put BGA chip on proper position, no need the help of silk-screen frame on PCB and lots of BGA rework experience;
2.HDMI Port, 1080P digital imaging technology,ensure BGA chip and PCB high definition display on LCD screen,Make sure the solder ball and pad one by one overlay;
3.Movable Camera,easy operation
4.With a beam split, zoom in, zoom out and micro-adjust functions, 270X digital zoom.
5.Mounting accuracy within ±0.01mm,Min pitch of BGA ball 0.15mm.
1. Seperate IC from PCB (IC including BGA/LGA/QFN etc)
2. Placement IC to PCB --Flip chip
3. BGA Reballing