Electroless Nickel plating

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Overview

Specifications

electroless nickel plating

 

Product

Condition

Remarks

P %

Make-up

pH

Temp(â)

Plating

(um)

 

MS-211

M, A, B, C

4.5-5.0

83-88

14-19

ο Non or Semi brightness, No Pb

ο For electronic component and aluminum cutting

8-1

 

MS-811

A, B, C

6.0-6.5

60-65

5-7

ο DMAB type, No Pb

ο PCB, ceramic, semiconductor,

   conductivity pattern

B:1%

 

MS-NISI

A, B

9.0-9.3

78-85

 

ο Silicon wafer

 

 

KINIKO-207

M, N, A, B

8.5-9.5

78-86

5-7

ο Ni-Co alloy type 

Co

30Wt%

And other kind of nickel plating chemicals