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      For TUF B350M-PLUS GAMING motherboard baffle chassis rear position baffle IO dust baffle customisation

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      Shenzhen Wenjun Technology Development Limited3 yrsCN
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      Key attributes

      Other attributes

      Place of Origin
      Guangdong, China
      Private Mold
      NO
      Products Status
      Stock
      Feature
      Replacement
      Application
      Desktop
      Condition
      New

      Packaging and delivery

      Selling Units:
      Single item
      Single package size:
      14X6X6 cm
      Single gross weight:
      0.100 kg
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      Lead time

      Quantity (pieces)1 - 5051 - 100 > 100
      Lead time (days)1030To be negotiated

      Product descriptions from the supplier

      1 - 9 pieces
      $4.00
      >= 10 pieces
      $3.00

      Variations

      Total options:
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