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HY500 grey copper aluminum heat sink thermal pad cpu compound series thermal conductive glue for led thermal paste cpu

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Key attributes

Industry-specific attributes

Products Status
Stock

Other attributes

Place of Origin
Guangdong, China

Private Mold
NO

Brand Name
Halnziye

Certifications
RoHS&CE&SVHC&MSDS

Brand
Halnziye

Series
HY510&HY520&HY530&HY550

Applications
CPU&VGA cooler//LED heat sink

Thermal conductivity
1.93~2.7W/m-K

Operation Temperature
-30~280 ℃

Packing
Syringe

Weight
10g~150g

Color
grey

Service
OEM&ODM

Lead time

Quantity (pieces)1 - 1000010001 - 2000020001 - 50000 > 50000
Lead time (days)3510To be negotiated

Customization

Customized logo
Min. order: 2000
Customized packaging
Min. order: 2000
Graphic customization
Min. order: 2000

Product descriptions from the supplier

Minimum order quantity: 20 pieces
$0.10 - $1.50

Variations

Total options:

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