High Performance Thermal Conducitive Silicon Pouring Sealant 1.thickness and color optional
2.Industry direct price
High Performance Thermal Conducitive Silicon Pouring Sealant Features
1.High compressibility, soft and flexible, designed for applications in low-stress application environment
2.Nice thermal conductivity
4.Meet with the environmental requirements of ROHS and UL
Electrically & Thermal Conductive Pad Typical Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
Application in big ways:
Automobiles, household appliances , computers, heat sink power supply, military goods, high power LED and motor control. -Interface between a power transistor, CPU or other heat-generating components.
-Isolate electrical components and power sources from heat sink and/or mounting brackets. -Interface for discrete semiconductors requiring low pressure spring clip mounting.
-Medical devices, military and industrial controls.
-between the Circuit board chip and heat sink of LCD-TV
-PDP chip and IC
-between the transformer and the shell.
-between Led particle base and aluminum plate
-between PCB board and its shell
-between IC and heat sink
-laptop NB display card and network card
- between STB IC and heat sink or shell
More pictures for your clear reference Best Serive: Professional manufacture with best price, service; High quality and excellent production capacity to support fast delivery. Customer Satisfied is always our mission. Quality Guarantee:
Comply with the standard operate process and 100% full inspection for every batch of shipment. With 1 year warranty period for products and have equal return policy for global customers.