RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

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Clientop Technology Co., Ltd. (shenzhen)

Custom manufacturer16 yrs

CN

RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board

Key attributes

Industry-specific attributes

Base Material

FR-4

Board Thickness

1.6mm

Other attributes

Model Number

3399E

Place of Origin

Guangdong, China

Brand Name

Clientop

Copper Thickness

standard

Min. Hole Size

3.2mm

Min. Line Width

see specification

Min. Line Spacing

see specification

Surface Finishing

see specification

CPU

Rockchip RK3399 highest 64-bit high performance CPU, 2.0 GHz

Inner storage

2G/4G

Built-in memory

EMMC 16G(8G/32G/64G optional)

Max resolution

3840*2160

Decoding resolution

max to 4K

OS

Android 7.1

Interface

USB/TYPE C/Mipi Camera/RS232/485/GPS/3G 4G

Packaging and delivery

Packaging Details

pressure proof plastic bag and carton

Port

Hongkong/Shenzhen

Selling units

Single item

Single package size

24X12X21 cm

Single gross weight

1.000 kg

Supply Ability

Supply Ability

1000 Piece/Pieces per Month

Lead time

Customization options

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

Customizable

Minimum order quantity: 2 pieces

$100-120

Quantity

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Item subtotal (0 variations 0 items)

$0.00 - $0.00

Shipping total

To be negotiated

Subtotal

$0.00 - $0.00