|Place of Origin:||Guangdong China (Mainland)||Classification:||Double Components Adhesives||Main Raw Material:||Epoxy|
|Usage:||Packing,Bonding electronic components||Brand Name:||King Bali||Model Number:||King Bali-1900|
|Density:||1.36~2.7||Breakdown voltge:||>10||Dielectric constant:||>4|
|Packaging Detail:||Barrel or Customized|
|Delivery Detail:||Within 3-5 Days|
1900 COB Thermal Bonding Glue
1.hot glue,high gel-point
3.strong adhesive strength
Thermal Bonding Glue for COB
King Bali 1900 Bonding Glue is fixed for bonding electronic components and packing, for metal, ceramics, glass, fiber products and rigid plastic encapsulation between bongding, with excellent adhesion strength of this series can be modulated as required curing time.
To avoid affecting the heat -conducting and adhesiveness, please make sure that the surface of the component is clean enough and theres no such as dirt, oil or salt on it. . Well mix A in the original container before using for precipitation might appear after long time storage.
Weigh A and B exactly according to the specified ratio and then mix them well color difference exist for A and B, please mix them till color difference disappears) . Please use the mixed products in 1-2 hour(s). Over-time using leads viscosity increase. A proper amount is suggested to avoid wasting. . Thicker than 0.15mm application of the products causes lower speed of curing, lower heat conductibility and waste. . The speed of curing might be affected by seasons and temperature. Low speed in winter is possible. Heating to accelerate uring is recommended.
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