Two components thermal conductive silicone pouring sealant
.Thermal conductivity:1.0W/M-K . Power transistor module
. Two components: A & B . LED driving power
. Auto-removing foam . Integrated chipset
. Good high & low temperature resistance . LED encapsulation
. Good physical and chemical stability . Power module
. RoHS and UL compliance . Telecom devices
Method of Use
Compound A and B per weight rate
. Fill and seal after completely compounding.
A: Gray B:Lucency
A/B compounding rate
60°C Shore C
Work time (Hour, 25°C)
Room Solidifying Time
12 months under 25°C with sealed container.
About our factory:
1.For small amount ,TT,Paypal,Western Union are accepted.
2.For big amount,TT,L/C are accepted.
More question ,pls feel free to send E-mail to sales at zzxkj.com.