ZR341 High thermal conductivity organic silicon encapsulating gum is a room temperature/heating curing and molding organic silicone materials. This kind of two-component elastic silicone potting, designed to protect in harsh conditions of electronic products.
ZR341 High thermal conductivity organic silicon encapsulating glue used new technology without heating, would be curing. When used according to 1:1 (weight ratio or the volume in the thorough mixing proportion of A and B two components, products will be in A certain time, form of the elasticity of curing buffer material.
1.Against moisture, dirt and other atmospheric composition
2.Relieve mechanical, thermal shock and vibration of mechanical stress and tension caused
3.Easy to repair
4.High frequency electric performance
5.No solvents, no cure by-products
6.Have stable mechanical and electrical properties between -50°C-200°C
7.Excellent flame retardancy
Black viscous liquid
White viscous liquid
Remark:All the above data come from 25 °C and 55% RH glue curing conditions after 7 days