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bluetooth embedded module

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Min.Order Quantity: 20 Piece/Pieces
Port: Incheon airport
Payment Terms: T/T
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Quick Details

Products Status:
Stock
Brand Name:
Firmtech
Model Number:
FB755AC
Place of Origin:
Gyeonggi-do, South Korea
Specification:
V2.1
Profile:
SPP, GAP
Picomets (point to multi point):
configurable up to 1:7
Power class:
Class1 ( 100m )
Size:
27.7 x 20.6 mm
Input power:
3.3V
Data Rate:
2,400 ~ 230,400 bps
Interface:
UART ( TTL )
Antenna type:
chip antenna
Certification:
CE,FCC,TELEC,KCC

Specifications

- bluetooth specification 2.1 support
- supports picomets(1:7), SPP profile, Class1, windows GUI
- controlled by AT command

Products Overview

 

FB755AS and FB755AC are Bluetooth 2.1 based Class 1 products that support the Bluetooth GAP and SPP profiles.They are one of the most compact Class 1 EDR products.
They are capable of a maximum of 1 to 7 communications simultaneously and support Piconets.
FB755AS uses a helical antenna while FB755AC uses a chip antenna, and their normal communica

ting distance is 100 m. In case of FB755AS, it can be increased to 1km by using a patch antenna.

 

Major Features of FB755AC & FB755AS

 

1. Bluetooth Specification 2.0 Support
2. Bluetooth Piconets(Point to Multipoint) are configurable up to(max 1:7)
3. Easily applicable to the Product with 12Pins Header type
4. Support AT Command, and capable to control FB755AC & FB755AS by using AT Command.
5. Easy to connect to use with Bluetooth PDA, Bluetooth USB Dongle, etc.
6. Provides the most compact size among Class 1 EDR.
7. Simply support the function of Bluetooth Firmware Update
8. Stable Data Transmission / Receipt

 

  

1. Specification

 

Specification  V2.1
 Profile  GAP, SPP
 Carrier Frequency  2.4GHz ISM Band
 Receiving Signal Range -83dBm (Typical)
 Transmission Power  16dBm (Typical)
 Power Consumption  Max 100mA
 Supply voltage  3.3V
 Power Class  Class1 (100m)
 Size 27.7 x 20.6 mm
 Data Rate 2,400 ~ 230,400 bps
 Operation Temperature  -30°C ~ 80°C
 Antenna Type  Chip Antenna
 Output Interface  UART (TTL level)

  

2. Pin Description

 

 

 

 

3. Pin Connection

   

 

 

  

 

 

- Supports Windows GUI  for Embedded module ( FB155BC, FB155BS, FB755AC, FB755AS ) 

 

 

 

 

- Start kit ( Model: FBZx5xXX ) for  Embedded module ( FB155BC, FB155BS, FB755AC, FB755AS )

 

 

 

 

      

  

 

    

- Ordering Information for Embedded module ( FB155BC, FB155BS, FB755AC, FB755AS ) 

 

  

 

 

 

 

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Manufactuer of Zigbee, Bluetooth products.
World's smallest Zigbee embedded modules: TinyBee(tm)
World's smallest Bluetooth embedded modules

For more information:
Marketing web: www.widecastint.com
Company web: www.firmtech.co.kr View detail

Basic Information

Business Type: Manufacturer, Agent  
Main Products: bluetooth module,bluetooth embedded module,bluetooth serial adapter,zigbee module,zigbee embedded module  
Number Of Employees: 11 - 50 People  

Trade & Market

Main Markets: North America
South America
Eastern Europe
Oceania
Western Europe
Central America
Northern Europe
Southern Europe
South Asia
Export Percentage: 41% - 50%  

Factory Information

Factory Location: B-606, Ssangyong IT Twin Tower, 442-5, Sangdaewon-dong,Jungwon  
No. of Production Lines: 5  
Number of R&D Staff: 11 - 20 People  
Number of QC Staff: 5 - 10 People  
Contract Manufacturing: OEM Service Offered   Design Service Offered  

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Unverified Supplier - FIRMTECH CO., LTD.
South Korea | Contact Details
Experience: Established 2005 , 5 years OEM

Communicate with Supplier:

Ms. Yujin Kim
Ms. Yujin Kim:
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