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electronic epoxy resin for potting

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US $4 - 7 / Kilogram | 500 Kilogram/Kilograms electronic epoxy resin for potting (Min. Order)
Supply Ability:
500 Ton/Tons per Month electronic epoxy resin for potting
Port:
shanghai
Seller Support:
Payment protection
On-time shipment
Product quality protection
Payment:
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Overview
Specifications
Other Names:
epoxy encapsulants
Place of Origin:
Shanghai, China (Mainland)
Classification:
Double Components Adhesives
Main Raw Material:
Silicone
Usage:
Construction, electronics
Brand Name:
jorle
Model Number:
ZR102
hardness:
80Shore D
conductivity factor:
0.4W/mK
water absorption:
<0.1 24h,25°C,%
dielectric strength:
>20 kV/mm(25°C)
Loss factor:
0.014(1MHz)(25°C)
dielectric constant:
3.53(1MHz)(25°C)
curing time:
80/1.5 or 25/10 °C/hr
operation time:
40min(25°C)
Mixture density:
1.57g/cm3(25°C)
Mixed viscosity:
700-1200mPa*s(25°C)
Packaging & Delivery
Packaging Details:
electronic epoxy resin for potting as your request to pack
Delivery Detail:
within 30days upon the receipt of your L/C or 30% deposit

Specifications

electronic epoxy resin for potting
1. two parts
2.shelf life is 9 months
3.adhesive to a wide range

electronic epoxy resin for potting

 

Description:  

ZR102 electronic epoxy resin for potting is a room temperature/heating cured epoxy resin. This kind of two-component epoxy adhesive used for design, protection the high strength or confidential electronic products.

 

ZR102 electronic epoxy resin for potting curing without heating. To 5:1 (weight ratio) completely mixed part A and part B, curing in a certain time, and form protection.

 

After curing glue has the following characteristics:

1.Against moisture, dirt and other atmospheric composition

2.High strength

3.Has confidential role  

4.Solvents, no cure by-products

5.Have stable mechanical and electrical properties between -45°C-120°C

 

Conventional performance:

 

test item

testing standard

unit

A

B

Outside view

visual inspection

---

Black viscous liquid

Brown liquid

viscosity

GB/10247-2008

mPa·s(25°C)

15000-35000

100-150

density

GB/T 13354-92

g/cm3(25°C)

1.75

1.14

 

Operation process:

 

test item

unit

value

mixture ratio

weight ratio

100:20

mixture ratio

volume ratio

100:40

Mixed viscosity

mPa·s(25°C)

700-1200

Mixture density

g/cm3(25°C)

1.57

operation time

min(25°C)

40

curing time

°C/hr

80/1.5 or 25/10

Operation time is a quantity of cement with 100 g.

 

A, B two components in proportion to remove mixing ratio, mixing, vacuum suction bubble in operation period, remove the potting products to casting, such as potting product is too big, suggest points potting, then according to The Times curing(80°C/90min or 25°C/10hr)

 

Operation caution:

 

1.Agent A place for a long time, maybe produce precipitation, mix part A and B access should be paid attention to save after sealing.

 

2.Mixing should pay attention to the same direction, otherwise, it will stir with too much bubble; Borders and the bottom of the container sizing material should also stir well, can appear otherwise stir caused by uneven local not curing phenomenon.

 

3.Casting the product vacuum pumping, remove again bubble can improve after curing products comprehensive performance.

 

4.Temperature is too low will lead to curing speed partial slow, heat cure advice; Potting thickness more than 2 cm above 80 °C not directly in the curing, lest cause explosive together.

 

5.This glue curing exothermic reaction, match the process as the quantity of cement can affect the operation, so the length of time with 100 g resin content of operation time is only a reference time.

 

Typical performance:

 

test item

testing standard

unit

value

hardness

GB/T 531.1-2008

Shore D

80

conductivity factor

GB/T 10297-1998

W/mK

0.4

expansion coefficient

GB/T 20673-2006

μm/(m,°C)

44

water absorption

GB/T 8810-2005

24h,25°C,%

<0.1

dielectric strength

GB/T 1693-2007

kV/mm(25°C)

>20

Loss factor

GB/T 1693-2007

(1MHz)(25°C)

0.014

dielectric constant

GB/T 1693-2007

(1MHz)(25°C)

3.53

volume resistance

GB/T 1692-92

(DC500V)Ω· cm

1.2×1015

Remark:All the above data come from 25 °Cand 55% RH glue curing conditions after 7 days.

 

 

Packing:

 

Agent A: 25 kg/pail; Agent B:10kg/pail

 

Storage and transportation:

 

1.Part A and part B need to avoid light, heat, save after sealed. (Can be used as the non-dangerous goods transport and storage)

2.Shelf life Agent A: 1 year, Agent B: months(25°C)

 

 

 

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