high temperature resistance UL94v0 grade liquid electrical resins epoxy for protecting components against moisture temperature
E536/H536 is a fire retardant, medium temperature cure epoxy potting/encapsulating compounds. It is designed for application where UL-94v0 approved, excellent electrical properties, high operating characteristic and large size casting or potting are required. It does not contain hazardous substances in the Candidate Lists of Restriction of Hazardous Substances (RoHs) or Substances of Very High Concern(SVHC) for green environmental protection.
1.Flame retardant approval UL94-V0.
2.Good electrical properties.
3.Long pot life.
4.Low shrinkage. Strong bonding strength to most substrates.
5.Excellent thermal conductivity.
6.Very good chemical resistance and water proof.
7.High heat distortion temperature (HDT).
Light amber liquid
1.60 – 2.00
1.10 – 1.25
50 - 160
Mixing ratio (by weight)
100 : 30
1,500 ~ 1,800
650 ~ 950
250 ~ 450
Pot life ( 25°C)
80°Cx 2 hours + 120°Cx4 hours
(in unopened, original container stored at cool, dark and dry environment)
Packaging & Shipping
1. Packaging: 10kgs, 15kgs
Instant online technical support
Custom made product available
Always on time delivery
Client centric approach
Cost effective solutions
Various payment methods available (bank wire transfer, paypal, western union)
Free samples available
Small MOQ available
OEM/ODM orders available
We offer a wide variety of adhesives, coatings, and specialty resin systems that fulfill our customer’s needs on demand. Our innovative products and solutions have been the cornerstone of many growth technologies in the polymer industry. From simple bonding applications to extreme and complex requirements, our many years of experience can help provide the starting point for your particular applications.
Our products are used worldwide and across many industries. We adhere to strict standards and certifications to make sure our products are the best.
We are a direct manufacturer and formulators of high performance polymers for the industry for over 30 years. All our resins are manufactured by us. We do not sell extras, surplus, re-packs or old inventory. We purchase and mix our raw materials in large volumes and on demand, so we can offer our products at lower prices. All kits are manufactured and packaged at the time of order so that we can guarantee fresh materials.
l Business name: Fong Yong Chemical Co., Ltd.
l Business address: 2nd Floor, No. 216-2, Zhong Zheng Road, Shulin Dist., New Taipei City 23867, Taiwan
l Email: fong.yong01 at msa.hinet.net
l Company web site: http://www.fongyong.com.tw
l Tel: +886 2 26824939
l Business type: Manufacturer, service provider, supplier
What is the difference between potting, casting and encapsulating in electronics processing?
An encapsulate or potting compound is a liquid resin system comprised of either one or two components that is poured over electrical and electronic components or circuit boards. These encapsulating resins are designed for a variety of applications to protect the product including electrical insulation, environmental protection from moisture, water and chemicals and mechanical attack from thermal shock and vibration. This protection allows these electronics to be used in many more applications ensuring reliable, long-term performance. This process can be done by several methods: potting, casting and encapsulation. Many names have been used interchangeably so there is some confusion of the terms. The most commonly used term is encapsulation or potting. The definitions mostly used in the industry is as follows:
Potting The potting method uses a “pot” or case or shell to put the device in and then pour the liquid potting compound to the top of the case covering the device and completely encasing it. The case becomes part of the finished unit. This is the most common method used, especially for high speed and many-units-per-hour production-line conditions.
Casting The casting method is the same idea but instead of a case that stays apart of the unit a mold is use and removed after the potting compound has hardened. Sometimes this is also referred to as encapsulation. This is used when a molded unit is desired.
Encapsulation The encapsulation method is also referred to when a device is dipped into a resin system and a thick coating completely surrounds the unit. Sometimes this is just called a “dip coating”. Molded device is a normally described as an encapsulated unit. MG Chemicals Range of Epoxy Potting Compounds SCH Technologies distribute the MG Chemicals range of epoxy potting compounds. These epoxies includes protection of sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals and include flame retardant materials qualified to UL, thermally conductively epoxies designed to release heat from a circuit board and a high temperature compound which ensures products can be protected where temperature is critical.