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The head and tail material zone melting technology requirements 1. N, resistivity than 50 chmom minority carrier lifetime is more than 100 mu m2. The block more than 30 mm3. The head and tail material not have bubbles, zone melting cannot have contact with the coil caused by fouling, cannot have more zone melting process flow of silicon or not melt. 4. It is best to disposable materials F, head and tail material (IC), draw best for disposable material 1. N, resistivity is more than 10 ohmom2. P type, the resistivity is greater than 0.5 ohmom3. The block more than 30 mm, slice thickness greater than 0.5 mm4. The head and tail material not bubble, draw more have not melt.