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two component sealant for electronic

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US $4 - 7 / Kilogram | 100 Kilogram/Kilograms two component sealant for electronic (Min. Order)
Supply Ability:
30 Ton/Tons per Month two component sealant for electronic
Port:
Shanghai
Seller Support:
Payment protection
On-time shipment
Product quality protection
Payment:
More

Quick Details

Place of Origin:
Shanghai, China (Mainland)
Classification:
Other Adhesives
Main Raw Material:
Silicone
Usage:
Construction, electronics
Brand Name:
Jorle
Model Number:
ZR102black
Certification authority:
RoHS, SGS, UL
Color:
Black,Red,Blue,White,transparent
Application:
For electronic
Safety:
Innocuous
density:
1.75g/cm3(25°C)
operation time:
40min(25°C)
Mixture density:
1.57g/cm3(25°C)
curing time:
80/1.5 or 25/10°C/hr
mixture ratio:
100:25weight ratio
Mixed viscosity:
700-1200mPa.s(25°C)

Packaging & Delivery

Packaging Details: two component sealant for electronic as your requirement to pack
Delivery Detail: Within 25-30 days upon receipt of your L/C or 30% deposit

Specifications

two component sealant for electronic
1.Avoid moisture, dirt andother atmospheric
composition
2.Pass RoHS, SGS,UL certificates

two component sealant for electronic

 

Description:

ZR102 two component sealant for electronic is a room temperature/heating cured epoxy resin. This kind of two-component epoxy adhesive used for design, protection the high strength or confidential electronic products.
ZR102  two component sealant for electronic curing without heating. To 4: 1 (weight ratio) completely mixed part A and part B, curing in a certain time, and form protection.

 

 

 

Characteristics:

1. Against moisture, dirt and other atmospheric composition
2. High strength
3. Has confidential role
4. Solvents, no cure by-products
5. Have stable mechanical and electrical properties between -45°c-120°c

 

6. Operation time is a quantity of cement with 100 g.

 

 

 

 

 

Conventional performance:

 

 

 

test item

testing standard

unit

A

B

Outside view

visual inspection

---

Black viscous liquid

Brown liquid

viscosity

GB/10247-2008

mPa·s(25°C)

15000-35000

100-150

density

GB/T 13354-92

g/cm3(25°C)

1.75

1.14

 

 

 

Operation process:

 

 

 

test item

unit

value

mixture ratio

weight ratio

100:25

mixture ratio

volume ratio

100:40

Mixed viscosity

mPa·s(25°C)

700-1200

Mixture density

g/cm3(25°C)

1.57

operation time

min(25°C)

40

curing time

°C/hr

80/1.5 or 25/10

 

 Operation time is a quantity of cement with 100 g.

 

 

 


A, B two components in proportion to remove mixing ratio, mixing, vacuum suction bubble in operation period, remove the potting products to casting, such as potting product is too big, suggest points potting, then according to The Times curing(80°c/90min or 25°c/10hr)

 

 

 

 

 

Operation caution:

 


1. Agent A place for a long time, maybe produce precipitation, mix part A and B access should be paid attention to save after sealing.

 

 

 


2. Mixing should pay attention to the same direction, otherwise, it will stir with too much bubble; Borders and the bottom of the container sizing material should also stir well, can appear otherwise stir caused by uneven local not curing phenomenon.

 

 

 


3. Casting the product vacuum pumping, remove again bubble can improve after curing products comprehensive performance.

 

 

 


4. Temperature is too low will lead to curing speed partial slow, heat cure advice; Potting thickness more than 2 cm above 80 ºC not directly in the curing, lest cause explosive together.

 


5. This glue curing exothermic reaction, match the process as the quantity of cement can affect the operation, so the length of time with 100 g resin content of operation time is only a reference time.

 

 

 

 

 

 

Typical performance:

 

test item

testing standard

unit

value

hardness

GB/T 531.1-2008

Shore D

80

conductivity factor

GB/T 10297-1998

W/mK

0.4

expansion coefficient

GB/T 20673-2006

μm/(m,°C)

44

water absorption

GB/T 8810-2005

24h,25°C,%

<0.1

dielectric strength

GB/T 1693-2007

kV/mm(25°C)

>20

Loss factor

GB/T 1693-2007

(1MHz)(25°C)

0.014

dielectric constant

GB/T 1693-2007

(1MHz)(25°C)

3.53

volume resistance

GB/T 1692-92

(DC500V)Ω· cm

1.2×1015

glass transition temperature

------

°C

105

 

Remark:All the above data come from 25 °C and 55% RH glue curing conditions after 7 days.

 

 

 

Packing:

 

 
Agent A: 25 kg/pail; Agent B: 10kg/pail

 

 
Storage and transportation:

 

 

 


1. Part A and part B need to avoid light, heat, save after sealed. (Can be used as the non-dangerous goods transport and storage)
2. Shelf life Agent A: 1 year, Agent B: Months(25&ordm;C).

 

 

 

 

 

 

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