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Mobile phone PCB

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Mobilephone PCB: PCB
Copper Thickness: 1oz
Brand Name: OEM
Surface Finishing: HAL
Min. Hole Size: 0.2mm
Min. Line Spacing: 0.1mm
Min. Line Width: 0.1mm
Place of Origin: Guangdong China (Mainland)
Fob Price: US$100-900000Shenzhen & HK
Port: Shenzhen & HK
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Minimum Order Quantity: 3 Piece/Pieces
Supply Ability: 200000 Square Meter per Year
Package: Vacuum
Delivery Time: Quick Lead Time

Supplier Details

US (HK) Industrial Co., Ltd.

[ Hong Kong ]
  • Business Type:Manufacturer, Distributor/Wholesaler
  • Product/Services:Printed Circuit Board, Flexible PC, PCB Assembly, Digital Flash ...
  • Online Showroom: 360 products
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Gold Supplier [ 3rd Year] Verified Supplier
  • Product Details
  • Company Profile
  • Mobilephone PCB: PCB
  • Copper Thickness: 1oz
  • Brand Name: OEM
  • Surface Finishing: HAL
  • Min. Hole Size: 0.2mm
  • Min. Line Spacing: 0.1mm
  • Min. Line Width: 0.1mm
  • Place of Origin: Guangdong China (Mainland)
  • Board Thickness: 1.6mm
  • Base Material: FR4
  • Model Number: UNA-50

Mobilephone PCB. Offer single-sided/double-sided pcb, multilayer pcb, rigid board, flexible pcb, pcba

Mobilephone PCB

Qroduct Name: Printed Circuit board (PCB)

Quality standard: IPC-A-600 class 2 / 3

Number of Layers: double layers; 4 layers-12 layers
Copper Thickness: 0.25-3.0oz, 0.5-3.0oz
Base Board Thickness: 0.3-3.2 mm;0.6-3.2mm
Incombustibility: 94V - 0,94V - 0
Peelable resistance: 12.3N/cm,12.3N/cm
Twist:  0.50%,0.50%
Insulation resistance: 10(11),10(11)
Test voltage: 10-300DCV,10-300DCV
Finished board area: 560*970mm, 560*970mm
Min. Line Width and Spacing: 0.1/0.1mm,0.1/0.1mm
Copper thickness in hole: 25.0um,25.0um
Min. pad diameter:
Inner layer: 0.5mm
Out layer:  0.076mm,0.076mm
Min. Hole Diameter: 0.25mm,0.20mm
Hole tolerance:
PTH: 0.076mm,0.076mm
NPTH:  0.05mm,0.05mm
Hole location tolerance: 0.076mm,0.05mm
Profile tolerance:
CNC Routing:  0.1mm,0.1mm
Punching:  0.13mm,0.13mm
Solder mask bridge ability: 0.1mm,0.075mm
Solder mask rigidity: 6H,6H
Solderable test: 245C, 5second
Thermal cycling ability: 288C, 10second
Surface Finishing:  OSP, HAL, Immersion AU, Rosin, Gold Finger
Quality standard: IPC-A-600F,IPC-ML-950

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