Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI
Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon
Max processing dimensions700mm×600mm
Thickness of board0.2mm-3.4mm
Outline Process Precision:±0.08mm
oard Width of the Inner Layer :0.075-1.6mm
Exterior Copper Width :18-210um
Exterior Copper Width :12-210um
Minimum Width of the Welding Ring :0.10mm
Minimum Width of Bridge with Solder Mask :0.01mm
Tolerance of Solder Resistance:±5%
Thickness of base copper foil18μ35μ70μ
Min. hole size0.1mm
Hole dia. Tolerance(PTH):±0.075mm
Hole dia. Tolerance(NPTH):±0.05mm
Min. line Space 0.075mm
Min. line Width(PTH)0.075mm
BURIED/BLIND VIA:compaction or HDI
Solder maskliquid photo-imageable (LPI) solder mask and thermosetting solder mask( Green, Yellow, Red , Black, Blue )
Chemical nickel gold PCB
