| Process capacity |
| Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI |
| Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
| Max processing dimensions700mm×600mm |
| Thickness of board0.2mm-3.4mm |
| Outline Process Precision:±0.08mm |
| oard Width of the Inner Layer :0.075-1.6mm |
| Exterior Copper Width :18-210um |
| Exterior Copper Width :12-210um |
| Minimum Width of the Welding Ring :0.10mm |
| Minimum Width of Bridge with Solder Mask :0.01mm |
| Tolerance of Solder Resistance:±5% |
| Thickness of base copper foil18μ35μ70μ |
| Min. hole size0.1mm |
| Hole dia. Tolerance(PTH):±0.075mm |
| Hole dia. Tolerance(NPTH):±0.05mm |
| Min. line Space 0.075mm |
| Min. line Width(PTH)0.075mm |
| BURIED/BLIND VIA:compaction or HDI |
| Solder maskliquid photo-imageable (LPI) solder mask and thermosetting solder mask( Green, Yellow, Red , Black, Blue ) |
| PROFILING METHOD:PUNCH,CNC,HANDSET,TRIMMING |
| Surface Treatment :HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP |
| Tolerence of contour processing+0.1mm |
| Being flame-resistant characteristic:94V-0 |
| Twist and wrap:< 0.5% |
| Specification: under IPC-600F class-II ,IPC-ML-950 or customer`s requirement |
| CERTIFICATEUL NO. E305540;TL9000,ISO9002;ISO14001:2004;QS9000;TS16949,E169497 |
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See larger image: lead-free hot air solder leveling
