Coupur primarily uses tow bonding methods to manufacture a bonded fin heat sink. They are: solder bonded heat sinks, and press fit bonded heat sinks. Each method has distinct advantages for the heat sink performance. For more information, regarding bonded fin heat sinks please speak with an CEH's engineer.

Bonded fin heat sinks are primarily designed to work in forced convection environments with high heat load. A heat pipe can also be used to assist with the bonded fin heat sink design. In such application, a heat pipe can be used to carry the heat to an area where the airflow is adequate and there is enough space available for bonded fin heat sink. Alternatively, in a sealed case, a heat pipe can be used to bring the heat from a source to the walls of the enclosure, to which a bonded fin heat sink can be attached to dissipate the heat to the environment. Finally a heat pipe can be used to increase a fin efficiency of a bonded fin heat sink by routing the heat pipe from the base to the top of the heat sink fins.

If you have an application in which you are considering a bonded fin heat sink, please . Coupur can design the bonded fin heat sink solution that will meet your requirements. Coupur also manufactures bonded fin heat sink to customer prints.