| Copper Thickness: | 0.5 - 4 oz |
| Surface Finishing: | Immersion gold, HASL, HASL Lead-free, Immersion Tin, Electrolytic NI/AU, Gold Finger, OSP, ENTEK |
| Brand Name: | NAN YA, INTERTEK...ETC |
| Min. Line Spacing: | 4/4 |
| Min. Line Width: | 3/3 |
| Place of Origin: | Taiwan |
| Board Thickness: | 0.25 - 6 mm |
| Base Material: | FR-4, FR-1, CEM-1 or CEM-3.Rogers, Arlon, Taconic, Teflon, High Temperature, Free halogen, Aluminum Based |
| Payment Terms: | L/C,T/T |
| Minimum Order Quantity: | 1 Piece/Pieces L/C at sight |
| Supply Ability: | 40000 Square Meter per Month |
| Package: | Vacuum |
| Delivery Time: | 10 - 15 DAYS |
PCB&PCBA
Material Base: FR-4, FR-1, CEM-1 or CEM-3.Rogers, Arlon, Taconic, Teflon, High Temperature, Free halogen, Aluminum Bas
PCB&PCBA
Base Material: | FR4 |
SPECIAL MATERIAL: | Rogers, Arlon, Taconic, Teflon, High Temperature, Free halogen, Aluminum Based |
Layer Coverage: | 1-20 layers |
Min Line Width/Space: | Outer Layer 3mils/3mils Inner Layer 4mils/4mils |
Surface Technique: | Immersion gold, HASL, HASL Lead-free, Immersion Tin, Electrolytic NI/AU, Gold finger, OSP, ENTEK |
Min. Hole Size: | 0.2mm |
Min. Blind-via: | 0.1mm |
Min. Buried-via: | 0.1mm |
Max. Board Size: | Double layer/Multilayer 510mm*620mm |
SMT/BGA. Pitch: | 10mils for SMT;20mils for BGA |
Aspect Ratio: | 8:1 |
Mini. Pad diameter: | 3mils |
Max. Board Thickness | 6.0mm |
Impedance Control | 50 Ω +/- 10% |
Finished copper weight from 0.5oz 4oz | |
Quality standard: IPC-A-600F
| Business Type: | Manufacturer |
| Product/Service (We Sell): | PCB,flex PCB,rigid PCB,board,PCBA |
| Number of Employees: | 51 - 100 People |
| Main Markets: | North America South America Eastern Europe Southeast Asia Africa Oceania Mid East Eastern Asia Western Europe |
| Contract Manufacturing: | OEM Service Offered |