Solar cell cutting machine

Equipment of YAG laser scribing machine series, the working lamp-house is adopted to Nd: YAG laser and the acoustic-optics modulation system, the numerical control X/Y work table, the device of the step motor-driven. It works precise under the computers control. The proprietary control software made the procedure of edit and revision simple and convenient, and it can display movement path at real time. The work table use the double gas warehouse vacuum absorption system, the T structure double work position works alternatively.
Application fields:
Dicing mono-crystalline and poly-crystalline silicon at solar industry, of non-crystalline silicon with solar cell chip and wafer
Engraving and lineation of crystal less silicon cell board at solar energy industry.
Cutting and lineation of silicon, germanium, gallium arsenide semiconductor substrate materials at electronic industry.
Price: USD16176.00 FOB Shanghai
Laser wavelength 1.064µm Scriber precision    ≤±10µm Max scriber thickness 1.2 mm Scriber line width    ≤50µm Laser repetition frequency 200Hz-50kHz
Max scriber speed  120mm/s Laser max power ≥50W ≥100W
Work platform size 350*350 mm Power supply  220V-240 V /50Hz/5kVA Cooling ways     Outside suspension type constant temperaturecirculation water cooling
  The adsorption of double gas warehouse vacuum, the T model platform is double position works in turn ..