Sell L850 Double In-Out Style (Twin Head)

Application :
1. Bonding of HSC (heat seal connector) to connect LCD and PCB.
2. Bonding of ACF onto TAB, FPC, LCD, or PCB.
3. Bonding of LCD modules, Telephone Sets, LCD games, AV Products, electronic translators,
PDA, cell phones, digital cameras, and computer monitors
4. Ideal for high volume production
5. Ideal for pitch smaller than 0.5mm

Features :
1. Double Head, double platform provides high efficiency which equal to 1 labor operates
2 machines at the same time.
2. Double flat Bed with advanced technology design of automatic sliding in-out function
which providing smooth and accurate bonding condition .
3. Precise configuration and the advance programmed logic control system enhances
quality of bonding.
4. The 2 sets high resolution CCD camera system with 110~260X multiples and 14" monitors
enables to visualize and bonding of fine pitch products.
5. With vacuum system for fixing devices.

Specification :
- Dimension: 1100 x 860 x 140 (mm)
- Max. length of bonding blade: 100mm
- Cylinder size: Dia.32 x 75 (mm )
- Timer range: 0.1s ~ 999hrs
- Temperature range: Room temperature to 400 degree
- Pressure range: 0.15 ~ 0.6MPa / 15-60Kgf/cm
- Power Supply: AC220V / 110V 1200W
- Max. size of bond objects: 127 x 127 mm
- Weight: 200KG