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      (In Stock Now) EMMC3 BGA Stencil BGA162 153 Nintendo Switch CPU Reballing stencil Kit AMAOE stencil For iPhone8 8P X Repair Tool

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      Anhui LeedeTech Co., Ltd.5 yrsCN

      Key attributes

      Other attributes

      Place of Origin
      Guangdong, China
      Brand Name
      N/A
      Product name
      BGA Reballing Stencils Template
      Suitable For
      nintendo switch
      Size
      Chip size
      Material
      Steel
      MOQ
      1pcs
      In stock
      Please contact us to check quantity in stock
      Package
      Carton Box
      Shipping
      Fedex, DHL,UPS,etc
      One stop supply
      Available
      Price
      Negotiable

      Packaging and delivery

      Packaging Details
      Carton Box
      Port
      Shenzhen,Guangzhou,Yiwu

      Supply Ability

      Supply Ability
      100 Set/Sets per Month
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      Lead time

      Quantity (sets)1 - 12 - 10 > 10
      Lead time (days)23To be negotiated

      Product descriptions from the supplier

      >= 1 sets
      $39.90

      Variations

      Total options:
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