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      250K BGA ball 0.35mm Leaded Solder Balls for reballing

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      Shenzhen LRF Technology Ltd.15 yrsCN
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      Key attributes

      Other attributes

      Place of Origin
      China
      Brand Name
      LRF
      Model Number
      0.35mm
      Product name
      solder ball
      Application
      repair
      Usage
      chips
      Type
      lead free
      Package
      box
      stock
      yes
      shipping way
      DHL,EMS.POST
      payment method
      TT,Paypal,Wetern union
      classify
      0.35mm
      weight
      250K

      Packaging and delivery

      Port
      shenzhen
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      Lead time

      Quantity (pieces)1 - 50 > 50
      Lead time (days)5To be negotiated

      Product descriptions from the supplier

      1 - 9 pieces
      $10.90
      10 - 49 pieces
      $8.90
      >= 50 pieces
      $7.90

      Variations

      Total options:
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