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5.0W/m-K China Thermal conductive non-silicone gap filler thermal pad for heatsink
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Dongguan Sheen Electronic Technology Co., Ltd.
10 yrs
CN
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Key attributes
Other attributes
Place of Origin
Guangdong, China
Brand Name
SHEEN
Model Number
AF600
Type
Insulation Sheet
Material
Non-silicone
Application
new energy vehicle /LED /cell phone
Tensile Strength
30 psi
Thickness
1.0~5.0 mm
Density
3.1 g/cm3
Thermal Conductivity
5.0 W/m-K
Elongation
50%
Applicable Temperature
-40~125 ℃
Compression Ratio(1mm@30psi)
20%
Packaging and delivery
Selling Units:
Single item
Single package size:
10X10X0.5 cm
Single gross weight:
0.300 kg
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Lead time
Quantity (pieces)
1 - 100
> 100
Lead time (days)
3
To be negotiated
Product descriptions from the supplier
Minimum order quantity: 100 pieces
$0.80 - $10.00
Variations
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5.0W/m-K China Thermal conductive non-silicone gap filler thermal pad for heatsink
