512G BGA Reballing Stencil For 6-X/11/12/13 14/15 IC Chip Planting Tin Template Steel Mesh phone motherboard repair tools

No reviews yet1 sold

Shenzhen City Yixin Technology Co., Ltd.4 yrs

Hover to zoom in

Key attributes

Other attributes

Brand name

Hycells

Application

Game players, Other device, Earphone, Computer & Laptop, Mobile phones, Camera

Material

OTHER

Used for iphone

Support

Product name

BGA Reballing Stencil Tool

Keyword

Multi-Function Universal Planting Tin Steel Mesh

Usage

Reballing universal IC pins

Function

for 6G 6P 6S 6SP 7G 7P 8G 8P X XR XS Max

Model

for 11 11Pro 11 Pro Max

Model 2

for 12 12Mini 12Pro Max

Feature

for 13 13Mini 13 Pro Max CPU Integrated Network

Packaging and delivery

Selling Units:

Multiple of 10

Package size per batch:

10X10X5 cm

Gross weight per batch:

0.500 kg

Lead time

Quantity (pieces)	1 - 2000	2001 - 10000	10001 - 100000	> 100000
Lead time (days)	7	12	20	To be negotiated

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece

Sample price:

$20.00/piece

Customization

Customized logo

Min. order: 10000

Customized packaging

Min. order: 10000

Graphic customization

Min. order: 10000

For more customization details, message supplier

Product descriptions from the supplier

1 batch = 10 pieces

50 - 999 pieces

$1.83

1000 - 4999 pieces

$1.75

>= 5000 pieces

$1.65

Variations

Total options:

Select now

Shipping

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece

Sample price:

$20.00/piece

Membership benefits

Quick refunds on orders under US $1,000View more

Protections for this product

Secure payments

Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols

Refund policy & Easy Return

Claim a refund if your order doesn't ship, is missing, or arrives with product issues, plus free local returns for defects