用途
BGA Rework Station for bga reballing
upper heat
IR 400W size 80x80mm
bottom heat
IR 800W size 180x180mm
Control mode of Upper
Independent temperature control precision ± 0.5%
Control mode of Bottom
Independent temperature control precision ± 0.5%
Size of applicable chips
70mmx70mm
Size of applicable PCB
400mm x 305mm