Automatic FPC FFC Pulse Heat Press Machine For Chip Bonding Newest

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Shenzhen Jiutu Technology Co., Limited

Multispecialty supplier9 yrs

CN

Key attributes

Other attributes

Place of Origin

Guangdong, China

Condition

New

Weight (KG)

90

Video outgoing-inspection

Provided

Machinery Test Report

Provided

Marketing Type

New Product 2021

Warranty of core components

2 years

Core Components

other

Warranty

2 years

Applicable Industries

Manufacturing Plant, Machinery Repair Shops

Showroom Location

United States

Brand Name

Jiutu

After-sales Service Provided

Engineers available to service machinery overseas

Name

ACF heat press machine

Function

flex bonding

Application

mobile phone camera row Wire binding

Application 2

smart glass bonding machine

Vacuum Pump

Needed

Working time

Only need 25--40 seconds

Application 3

projector driver film bonding

Size

64*55*67cm

Voltage

220V

Packaging and delivery

Selling Units:

Single item

Single package size:

67X57X55 cm

Single gross weight:

68.000 kg

Lead time

Product descriptions from the supplier

1 - 4 pieces

$4,850.00

>= 5 pieces

$4,500.00

Variations

Total options:

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