Automatic Voidless Forming Soldering System Reflow Oven IGBT Module Vacuum Reflow Oven for Chips

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Chengliankaida Technology Co., Ltd.

Custom Manufacturer

2 yrs

CN

Service

1-year warranty

1-year warranty

Access free parts replacement and repair coverage

Key attributes

type

Reflow Solder

voltage

380V

condition

New

place of origin

Hebei, China

brand name

HVT

usage

Chip soldering

dimensions

3950*1960*1900

current

380V, 50HZ/60HZ

warranty

2 years

weight (kg)

2900 KG

Product name

IGBT module vacuum reflow oven

Model

KD-V400

Heat Zone Numbers

3 zones

Cooling zone number

1 zone

Heating way

Contacting

Max temperature

≥450℃

Gas

Nitrogen; Formic acid

Height of Chamber

80mm

Void Rate

Void rate≤1%

Vacuum

Under 1 mbar

Packaging and delivery

Packaging Details

Standard export wooden box

Port of dispatch

Beijing/Tianjin

Selling Units

Single item

Packaging examples

Supply capacity

Supply Ability

10 pieces per Month

Lead time

Customization options

Customized logo (Min. order: 1 piece)

Customized packaging (Min. order: 1 piece)

Graphic customization (Min. order: 1 piece)

View details

Product descriptions from the supplier

1 - 2 pieces

$420,000

>= 3 pieces

$410,000

Variations

Customization options

Customized logo (Min. order: 1 piece)

Customized packaging (Min. order: 1 piece)

Graphic customization (Min. order: 1 piece)

Supplier’s customization ability

Minor customization

Drawing-based customization

Sample-based customization

Full customization

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

4 interest-free payments with

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1-year warranty

Access to free parts replacement and repair coverage