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      BGA Reballing Material 250K 0.5MM 0.55MM Leaded Free BGA Solder Ball Tin Solder Sphere Sn96.5Ag3Cu0.5

      No reviews yet#19Most popular in Solder Ball
      Anhui LeedeTech Co., Ltd.5 yrsCN
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      Key attributes

      Other attributes

      Place of Origin
      Guangdong, China
      Brand Name
      PMTC
      Product name
      BGA Solder Ball Sphere
      Material
      Sn96.5Ag3.0Cu0.5
      Application
      For BGA Reballing Rework
      Size
      0.2-0.76mm Optional
      Quantity Per Bottle
      250000pcs
      Melting point
      217 Degree
      Certification
      Available
      Package
      Carton Box
      Lead Time
      in stock
      Price
      Negotiable

      Packaging and delivery

      Packaging Details
      Carton Box
      Port
      Shenzhen,Guangzhou,Yiwu

      Supply Ability

      Supply Ability
      100 Set/Sets per Month
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      Lead time

      Quantity (sets)1 - 12 - 10 > 10
      Lead time (days)23To be negotiated

      Product descriptions from the supplier

      1 - 4 sets
      $29.00
      >= 5 sets
      $28.50

      Variations

      Total options:
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