Número de Modelo
JDWY03-001-032
Polish
Single side polished (SSP) / Double side polished (DSP)
Orientation
C plane (0001) off angle toward M-axis 0.2 ± 0.1°
Structure (ultra-low current design)
0.2μm pGaN/0.5μm MQWs/2.5μm nGaN/2.0μm uGaN
Thickness/std
5.5 ± 0.5μm/ <3%
Useable Area
> 90% (edge and macro defects exclusion)
Package
Packaged in a cleanroom in a single wafer container