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C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom

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Shenzhen Nengliang Technology Co., Ltd.1 yrCN
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom
C0603C682M3GAC New and Original IC chips Electronic components integrated circuit SMD DIP Bom

Key attributes

Other attributes

Place of Origin
Taiwan, China, Japan
Brand Name
Original
Model Number
C0603C682M3GAC
Product Completion Type
C0603C682M3GAC
Mounting Type
SOP DIP SOT QFP QFN BGA
Description
C0603C682M3GAC
Application
C0603C682M3GAC
Series
C0603C682M3GAC
Features
C0603C682M3GAC
Manufacturing Date Code
2024

Packaging and delivery

Selling units
Single item
Single package size
10X10X5 cm
Single gross weight
kg
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Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
1 - 99 pieces
$0.50
100 - 999 pieces
$0.40
>= 1000 pieces
$0.30

Variations

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