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CPU IC Repair Pin Solder Tin Plant Net Stencil for Nintendo Switch BGA200 NFCBEA BCM4354 MAX77620A MAX77812 CYW20734 Reballing
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Key attributes
Industry-specific attributes
Compatible Platform
for Nintendo switch lite, For Nintendo Switch, For Nintendo Switch Pro, For Switch Joy-Con, Switch, Nintendo Switch
Other attributes
Place of Origin
Guangdong, China
Private Mold
Yes
Brand Name
HIGOPLAY
Model Number
CH-NS-061
Type
Repairing Tool
Product name
Tin Plant Stencil for Switch CPU ICs
Size
7*7*0.02
Function
IC Pin Solder Tin Plant Net
Suitable for
IC BGA200 NFCBEA BCM4354 MAX77620A MAX77812 CYW20734
Still Compatible with
IC ODNX02-A2 ODNX02-R-A2 0DNX02-R-A2
Keywords
CPU Reballing
Type
Easy Reballing
Feature 1
You don't need to position the holes manually one by one.
Feature 2
Save your time when tin plated or BGA reballing
Feature 3
Solve your mis-positioned when reballing or tin plated.Reballing
Packaging and delivery
Packaging Details
Bulk
Selling Units:
Single item
Single package size:
7X7X0.02 cm
Single gross weight:
0.250 kg
Lead time
| Quantity (pieces) | 1 - 500 | > 500 |
| Lead time (days) | 7 | To be negotiated |
Product descriptions from the supplier
Minimum order quantity: 5 pieces
$5.50 - $33.50Membership benefits
Quick refundsView more
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