材料
C7025 SUS301 H-Copper Alloy
Plating specification
Tinning of contact points
Current Rating
30A Max. AC/DC
Contact Resistance
≤20MΩ Max
Pressure connection diameter
0.5- 1.0/1.0-2.5/2.5-4.0
Temperture Range
-40℃ to +125℃
OD
1.4-2.3/2.2-3.0/3.4-3.7
Four guidelines
Brass/nickel/gold plated surface