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DS2482S-100+T&R Small-Outline IC,Wafer-Level Package 3x3 Bump Single-Channel 1-Wire Master DS2482S-100+T&R
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Key attributes
Other attributes
Place of Origin
China
Brand Name
original
Model Number
DS2482S-100+T&R
Description
Single-Channel 1-Wire Master
Packaging Type
Small-Outline IC,Wafer-Level Package 3x3 Bump
Application
Evaluation board
Type
Evaluation board
Package / Case
Small-Outline IC, Wafer-Level Package 3x3 Bump
Series
Evaluation board
Features
Single-Channel 1-Wire Master
Mounting Type
Small-Outline IC, Wafer-Level Package 3x3 Bump
Manufacturing Date Code
Standard
Cross Reference
Standard
Lead time
| Quantity (pieces) | 1 - 10 | 11 - 100 | > 100 |
| Lead time (days) | 3 | 7 | To be negotiated |
Product descriptions from the supplier
10 - 99 pieces
$0.03
100 - 499 pieces
$0.02
>= 500 pieces
$0.01
Variations
Total options:
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