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ESOP8L IC /semiconductor packaging stamping lead frame /leadframe

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Key attributes

Other attributes

Place of Origin
Guangdong, China
Brand Name
FILLGOLD
Model Number
ESOP 8L
Type
Silicon Wafer
Product Name
ESOP8L(95*130)-12R
Type
SOP,SOT,LQFP,SSDIP,DIP,SSOP,TSSOP,SKDIP,SDIP,QSOP,etc
Material
A194/C19210/C194/C7025/C2680
Function
Semiconductor package
Size
Customized OEM
Thickness (MM)
Customized
Process
progressive Stamping
Max Lead
64 PIN
Max Width
100mm
Surface Finish
AG Plating /Roughning

Packaging and delivery

Selling Units:
Single item
Single package size:
20X20X20 cm
Single gross weight:
0.100 kg

Lead time

Quantity (pieces)1 - 200 > 200
Lead time (days)30To be negotiated
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece
Sample price:
$2.00/piece

Customization

Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1

Product descriptions from the supplier

100 - 999 pieces
$2.00
>= 1000 pieces
$1.00

Quantity

Shipping

Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece
Sample price:
$2.00/piece

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