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Forming reflow oven vacuum soldering system vacuum eutectic soldering machines for chips

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Chengliankaida Technology Co., Ltd.شركة مصنِّعة لمنتجات مخصصة1 yrCN

Key attributes

Other attributes

Condition
New
Applicable Industries
Manufacturing Plant, Seimiconductor Equipment, IGBT Module
Showroom Location
None
Video outgoing-inspection
Provided
Machinery Test Report
Provided
Marketing Type
New Product 2020
Warranty of core components
2 years
Core Components
Vacuum pump, Heating Plate, Software
Place of Origin
Hebei, China
Warranty
2 years
Key Selling Points
Accurate temperature control
Weight (KG)
2600 KG
Type
Reflow Solder
Brand Name
HVT
Use
Chip Soldering
Voltage
380V
Dimensions
3200*1850*1900mm
Current
380V, 50HZ/60HZ
Product name
Forming reflow oven
Heating method
Contacting
Heating Zones
2 zones
Cooling Zones
1 zones
Soldering area
350*400MM
Gas support
Nitrogen; Formic acid
Max temperature
≥400℃
Temperature acurracy
±1℃
Height of Chamber
80mm
Heating platform
Red copper special treatment

Packaging and delivery

Packaging Details
Standard export wooden box
Port
Tianjin

Supply Ability

Supply Ability
10 Piece/Pieces per Month

Lead time

Quantity (pieces)1 - 23 - 5 > 5
Lead time (days)2035To be negotiated

Customization

Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1

Product descriptions from the supplier

1 - 2 pieces
$360,000.00
>= 3 pieces
$355,000.00

Variations

Total options:

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