Heating BGA chipset notebook desktop computer motherboard BD85HM55 north and south bridge piece 80*80 special ball steel mesh

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Shenzhen Futian District Jiaxinda Technology Electronic Trade Department

Multispecialty Supplier

9 yrs

CN

Key attributes

Brand Name

original

Model Number

BD82HM55

Place of Origin

Florida, United States

Module

BD85HM55

Packaging and delivery

Packaging Details

original packaging,Pipe, coil, bulk,full container

Port of dispatch

Shenzhen

Selling Units

Single item

Packaging examples

Supply capacity

Supply Ability

10000000 pieces per Day

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

Minimum order quantity: 5 pieces

$5-10

Variations

Supplier’s customization ability

Minor customization

Drawing-based customization

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

4 interest-free payments with

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Easy Return

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Money-back protection

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