High Density SIM CARD package IC substrate
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Key attributes
Other attributes
Place of Origin
China
Brand Name
N/A
Model Number
UO-21015A-A
Targrt products
PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
Core material
MGC,Doosan,LG,Hitachi,Sumitomo,AMC
SR material
Taiyo,Hitachi,Sumitomo,SanEI
Pattern
Tenting,MSAP,PSAP,ETS,SAP
Soldermask
PSR series
Surface Finish
E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au
Warranty
1 year
Size
Customized
MOQ
20 strips
Brand
No brand
Type
LOGIC ICS
Packaging and delivery
Port
shenzhen
Lead time
| Quantity (square meters) | 1 - 200 | > 200 |
| Lead time (days) | 30 | To be negotiated |
Customization
Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1
For more customization details, message supplier
Product descriptions from the supplier
1 - 9 square meters
$9.00
>= 10 square meters
$0.10
Quantity
Shipping
Shipping solutions for the selected quantity are currently unavailableItem subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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