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      High Strength Communication Electronic Flip Chip Encapsulation Quick Curing Glue Low Temperature One-component UV Cured Adhesive

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      Huizhou Junbang Technology Co., Ltd.2 yrsCN

      Key attributes

      Industry-specific attributes

      CAS No.
      DM-6108

      Other attributes

      Place of Origin
      Guangdong, China
      Main Raw Material
      Epoxy Resin
      Usage
      Construction
      Other Names
      UV Curing Adhesives
      Classification
      Other Adhesives
      Brand Name
      DeepMaterial
      Model Number
      DM-6180
      Type
      Low Temperature UV Cured Adhesive
      Product series
      UV Cured Adhesive
      Colors
      White
      Viscosity
      8700 cps
      Curing time
      80℃ 2min
      Curing method
      Heat curing
      TG
      54℃
      Hardness
      80D
      Store
      *-40℃ /6 M

      Packaging and delivery

      Packaging Details
      UV Cured Adhesive Package:
      PE/PP Plastic Tube+Aluminum Foil Bag+Ice Pack/Dry Ice+Foam Incubator
      Port
      Shenzhen

      Supply Ability

      Supply Ability
      100000 Piece/Pieces per Month UV Cured Adhesive
      Show more

      Lead time

      Quantity (pieces)1 - 1 > 1
      Lead time (days)7To be negotiated

      Customization

      Customized logo
      Min. order: 500
      Customized packaging
      Min. order: 500
      Graphic customization
      Min. order: 500
      For more customization details, message supplier

      Product descriptions from the supplier

      1 - 499 pieces
      $15.00
      >= 500 pieces
      $10.00

      Quantity

      Shipping

      Shipping solutions for the selected quantity are currently unavailable
      Item subtotal (0 variations 0 items)
      $0.00
      Shipping total
      $0.00
      Subtotal
      $0.00

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