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High-speed thinning of silicon wafers/Wafer Thinning Machine/Vertical grinder

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Key attributes

Other attributes

Type
Universal
CNC or Not
CNC
Condition
New
Place of Origin
Guangdong, China
Weight (KG)
900
Warranty
2 years
Key Selling Points
Competitive Price
Showroom Location
India, France, Viet Nam, South Korea, Malaysia, United States, United Kingdom, Indonesia, Germany
Applicable Industries
Manufacturing Plant
Marketing Type
New Product 2022
Machinery Test Report
Provided
Video outgoing-inspection
Provided
Warranty of core components
2 years
Core Components
PLC
Brand Name
minderpack
Dimension(L*W*H)
1200*550*1550mm
Power (kW)
1.5
After-sales Service Provided
Field maintenance and repair service
After Warranty Service
Video technical support

Packaging and delivery

Packaging Details
grinder
Port
guangzhou/shenzhen/hongkong

Supply Ability

Supply Ability
80 Set/Sets per Month

Lead time

Quantity (sets)1 - 12 - 5 > 5
Lead time (days)1520To be negotiated

Customization

Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1

Product descriptions from the supplier

>= 1 sets
$60,000.00

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00

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