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Highvacuum soldering oven KD-V5 fluxless process vacuum reflow soldering oven Vacuum Reflow Oven

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Chengliankaida Technology Co., Ltd.Custom manufacturer1 yrCN

Key attributes

Other attributes

Condition
New
Applicable Industries
IGBT module, Semiconductor equipment, Chip soldering
Showroom Location
None
Video outgoing-inspection
Provided
Machinery Test Report
Provided
Marketing Type
Hot Product 2019
Warranty of core components
2 years
Core Components
PLC, Vauum pump, Heating plate, Software
Place of Origin
Hebei, China
Warranty
2 years
Key Selling Points
Accurate temperature control
Weight (KG)
1100 KG
Type
Reflow Solder
Brand Name
HVT
Usage
Chip soldering
Voltage
380V
Dimensions
2600*900*2150mm
Current
380V, 3-phase five-wire
Name
Multi-layer formic acid soldering oven
Soldering size
350*450*100mm*5
Layer
5-layers
Gas
Nitrogen; Formic acid
Platform heating speed
35-40℃ /min
Platform cooling speed
100-120℃/min
Temperature evenness
≤±1%
Chamber with watch window
Chamber with watch window
Temperature range
Room-400℃

Packaging and delivery

Packaging Details
Standard export wooden box
Port
Beijing/Tianjin

Supply Ability

Supply Ability
10 Piece/Pieces per Month

Lead time

Customization

Product descriptions from the supplier

1 - 2 pieces
$105,500.00
>= 3 pieces
$100,500.00

Variations

Total options:

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