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Hot Selling New and Original Support BOM BGA Integrated Circuit IC Chip H26M52103FMR
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Shenzhen LRF Technology Ltd.
15 yrs
CN
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Key attributes
Other attributes
Place of Origin
Taiwan, China
Brand Name
LRF
Model Number
H26M52103FMR
Description
BGA Chipset
Packaging Type
Original
Application
Motherboard
Package / Case
BGA
Mounting Type
Soldering
Manufacturing Date Code
Newest
Condition
Newest
Payment
Trade Assurance
Warranty
90 Days
Shipment
DHL\UPS\FEDEX\EMS\POST.etc
Lead time
1-3 Days
MOQ
1pc
Description
Chipset
Applications
Laptop
Service
24hour Service
Packaging
BGA
Packaging and delivery
Packaging Details
Standard carton/Tray&Reel
Supply Ability
Supply Ability
1000 Piece/Pieces per Day
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Lead time
Quantity (pieces)
1 - 100
> 100
Lead time (days)
3
To be negotiated
Customization
Customized logo
Min. order: 10000
Customized packaging
Min. order: 10000
For more customization details,
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Shenzhen LRF Technology Ltd.
15 yrs
Located in CN
Order with confidence
Evaluated as top-rated supplier
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Product descriptions from the supplier
Minimum order quantity: 1 piece
$3.00 - $4.00
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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