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Hot Selling New and Original Support BOM BGA Integrated Circuit IC Chip H26M52103FMR

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Key attributes

Other attributes

Place of Origin
Taiwan, China

Brand Name
LRF

Model Number
H26M52103FMR

Description
BGA Chipset

Packaging Type
Original

Application
Motherboard

Package / Case
BGA

Mounting Type
Soldering

Manufacturing Date Code
Newest

Condition
Newest

Payment
Trade Assurance

Warranty
90 Days

Shipment
DHL\UPS\FEDEX\EMS\POST.etc

Lead time
1-3 Days

MOQ
1pc

Description
Chipset

Applications
Laptop

Service
24hour Service

Packaging
BGA

Packaging and delivery

Packaging Details
Standard carton/Tray&Reel

Supply Ability

Supply Ability
1000 Piece/Pieces per Day

Lead time

Quantity (pieces)1 - 100 > 100
Lead time (days)3To be negotiated

Customization

Customized logo
Min. order: 10000
Customized packaging
Min. order: 10000

Know your supplier

15 yrsLocated in CN

Order with confidence

Evaluated as top-rated supplier

Product descriptions from the supplier

Minimum order quantity: 1 piece
$3.00 - $4.00

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00

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