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Hot air infrared soldering station GPU BGA IC chip reballing kit for laptop xbox360 ps3 ps4

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Key attributes

Other attributes

Place of Origin
Guangdong, China
Brand Name
Dinghua
Product name
BGA reballing kit
Top heater
800W
Bottom heater
Bottom hot air heating 1200W, IR preheating 2700W
Power
220V 50HZ/60HZ
Positioning
V-groove, PCB boards can be adjusted in X axis by universal fixture
Temperature control
K-type closed loop
Temperature accuracy
±2°C
PCB size
Max 400*380mm, Min 20*20mm
Chip size
1*1-80*80mm
Application
Chip level repairing,Soldering and desoldering

Packaging and delivery

Packaging Details
Packed in standard plywooden case,suitable for BGA reballing kit
Port
Shenzhen

Supply Ability

Supply Ability
500 Piece/Pieces per Month for BGA reballing kit

Lead time

Quantity (pieces)1 - 23 - 1011 - 150 > 150
Lead time (days)71530To be negotiated

Customization

Customized logo
Min. order: 8
Customized packaging
Min. order: 8
Graphic customization
Min. order: 8

Product descriptions from the supplier

Minimum order quantity: 1 piece
$499.00 - $1,999.00

Variations

Total options:

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