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MAX14531EEWC+T USB 2.0 Hi-Speed and Audio Switches Wafer-Level Package 3x4 Bump, Full Array Interfaces MAX14531EEWC+T
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Key attributes
Other attributes
Place of Origin
China
Brand Name
original
Model Number
MAX14531EEWC+T
Application
Interfaces
Type
Interfaces
Series
Interfaces
Description
USB 2.0 Hi-Speed and Audio Switches
Packaging Type
Wafer-Level Package 3x4 Bump, Full Array
Function
USB 2.0 Hi-Speed and Audio Switches
Interface
standard
Operating Temperature
-40 to 85°C
Data Rate
standard
Package / Case
Wafer-Level Package 3x4 Bump, Full Array
Voltage - Supply
standard
Current - Supply
standard
Number of Circuits
standard
Protocol
standard
Features
USB 2.0 Hi-Speed and Audio Switches
Mounting Type
Wafer-Level Package 3x4 Bump, Full Array
Manufacturing Date Code
standard
Cross Reference
standard
Lead time
| Quantity (pieces) | 1 - 10 | 11 - 100 | 101 - 1000 | > 1000 |
| Lead time (days) | 3 | 5 | 7 | To be negotiated |
Product descriptions from the supplier
10 - 99 pieces
$0.03
100 - 999 pieces
$0.02
>= 1000 pieces
$0.01
Variations
Total options:
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