512G BGA Reballing Stencil For 6-X/11/12/13 14/15 IC Chip Planting Tin Template Steel Mesh phone motherboard repair tools

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Shenzhen City Yixin Technology Co., Ltd.4 yrs

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Key attributes

Other attributes

Brand name

Hycells

Application

Game players, Other device, Earphone, Computer & Laptop, Mobile phones, Camera

Material

OTHER

Used for iphone

Support

Product name

BGA Reballing Stencil Tool

Keyword

Multi-Function Universal Planting Tin Steel Mesh

Usage

Reballing universal IC pins

Function

for 6G 6P 6S 6SP 7G 7P 8G 8P X XR XS Max

Model

for 11 11Pro 11 Pro Max

Model 2

for 12 12Mini 12Pro Max

Feature

for 13 13Mini 13 Pro Max CPU Integrated Network

Packaging and delivery

Selling Units:

Multiple of 10

Package size per batch:

10X10X5 cm

Gross weight per batch:

0.500 kg

Lead time

Quantity (pieces)	1 - 2000	2001 - 10000	10001 - 100000	> 100000
Lead time (days)	7	12	20	To be negotiated

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece

Sample price:

$20.00/piece

Customization

Customized logo

Min. order: 10000

Customized packaging

Min. order: 10000

Graphic customization

Min. order: 10000

For more customization details, message supplier

Product descriptions from the supplier

1 batch = 10 pieces

50 - 999 pieces

$1.83

1000 - 4999 pieces

$1.75

>= 5000 pieces

$1.65

Variations

Total options:

Select now

Shipping

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 5 piece

Sample price:

$20.00/piece

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