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Multi-use High Quality hallogen-free Epoxy underfill for post-assembly filling and protection of BGA/CSP/uBGA
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Xiamen Aibeisen Electronics Ltd
1 yr
CN
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Key attributes
Industry-specific attributes
CAS No.
mixture
Other attributes
Place of Origin
Fujian, China
Main Raw Material
Epoxy
Usage
Packing, electronic underfill
Classification
Other Adhesives
Brand Name
APS
Model Number
HP23124
Packaging and delivery
Packaging Details
10mL, 30mL, 55mL tube
Selling Units:
Single item
Single package size:
5X3X20 cm
Single gross weight:
0.070 kg
Supply Ability
Supply Ability
100 Piece/Pieces per Day
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Lead time
Quantity (pieces)
1 - 500
> 500
Lead time (days)
180
To be negotiated
Know your supplier
Xiamen Aibeisen Electronics Ltd
1 yr
Located in CN
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Product descriptions from the supplier
5 - 499 pieces
$20.00
>= 500 pieces
$8.00
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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